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9 PACKAGE
S1C33210 PRODUCT PART EPSON A-87
9 Package
9.1 Plastic Package
QFP15-128pin
(Unit: mm)
14
±0.1
16
±0.4
6596
14
±0.1
16
±0.4
33
64
INDEX
0.16
321
128
97
1.4
±0.1
0.1
1.7max
1
0.5
±0.2
0°
10°
0.125
0.4
+0.1
–0.05
+0.05
–0.025
Limit of power consumption
The chip temperature of an LSI rises according to power consumption. The chip temperature can be calculated
from environment temperature (Ta), thermal package resistance (θ) and power consumption (P
D).
Chip temperature (Tj) = Ta + (P
D × θ) (°C)
As a guide, normally keep the chip temperature (Tj) lower than 85°C.
The thermal resistance of the QFP15-128pin package is as follows:
Thermal resistance (°C/W) = 110 to 120°C (90 to 100°C for Cu lead frame)
This thermal resistance is a value under the condition that the measured device is hanging in the air and has no
air-cooling. Thermal resistance greatly varies according to the mounting condition on the board and air-cooling
condition.